***********************************************************************
***********           PANJIT International Inc.             ***********
***********************************************************************
*Jan 25, 2018                                                         *
*                                                                     *
*This SPICE Model describes the characteristics of a typical device   *
*and does not respresent the specification. Designer should refer to  *
*the same type name data sheet for specification limits.              *
***********************************************************************
*$
.subckt 1SMB3EZ8P2 A K
.param
+vc0 = 3.712e-11	 vc1 = 2.307e-11	 vc2 = 1.812e-14	 vc3 = 2.406
+tc1 = 2.533e-2		 tc2 = 1.714e-2		 tc3 = 9.737e-3		 tc4 = 6.121e-3
d1 A K zener
g1 K A value = {(vc0+vc1*v(K,A)^2)*(1.0+tc1*(temp-25)*exp(tc2*(temp-25)))+(vc2*exp(vc3*v(K,A)))*(1.0+tc3*(temp-25)*exp(tc4*(temp-25)))}
.model zener d
***** flag parameter ***
+level = 1   
***** dc model parameter ***
+ is = 2.807e-15	   n = 1.011		  rs = 1.872e-2		 ikf = 3.521
+ibv = 100e-3		 nbv = 0.8		  bv = 8.2
***** capacitance parameter ***
+cjo = 5.696e-10	   m = 3.233e-1		  vj = 5.881e-1
+ fc = 0.5                      
***** temperature coefficient ***
+tnom = 25		  eg = 1.128		 xti = 3
+trs1 = 1.822e-4	trs2 = 4.176e-6		tbv1 = 4.909e-4
.ends 1SMB3EZ8P2 
*$
